Enlarge the process window of patterns in 22nm node by using mask topography aware OPC and SMO

Yansong Liu Yansong Liu,Lile Lu Lile Lu,Xiaojing Su Xiaojing Su,Yajuan Su Yajuan Su,Fengliang Liu Fengliang Liu,Junwei Lu Junwei Lu,Zhiyang Song Zhiyang Song,Moran Guo Moran Guo,Lisong Dong Lisong Dong,Shengrui Zhang Shengrui Zhang,Weijie Shi Weijie Shi,Yayi Wei Yayi Wei

doi:10.1109/cstic.2015.7153352

Enlarge the process window of patterns in 22nm node by using mask topography aware OPC and SMO

Yansong Liu Yansong Liu, Lile Lu Lile Lu + Show 10 more

https://doi.org/10.1109/cstic.2015.7153352

Copy DOI

Publication Date: Mar 1, 2015

Affiliation: State Key Laboratory on Integrated Optoelectronics, Chinese Academy of Sciences, Shenzhen Metro (China)

#Opaque MoSi On Glass #Source Mask Optimization + Show 8 more

Abstract
Full-Text
Similar Papers

Abstract

The mask three dimensional (M3D) effect of thin Opaque MoSi on Glass (OMOG) mask is analyzed by investigating the difference of diffraction orders between rigorous electro-magnetic field (EMF) simulation and thin mask approximation. Then the potential of extending the process window of AttPSM and OMOG masks with 22nm node SRAM cell patterns by using Optical Proximity Correction (OPC) and Source Mask Optimization (SMO) is compared. Both the OMOG and AttPSM masks are simulated and discussed. For this case, the results show that the overlapped process window (PW) greatly reduces without considering the M3D effects in OPC. In addition, M3D aware SMO improves the total process window one step further.

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Similar Papers

Paper Title

Journal

Date

Author

View more papers

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.