Abstract
Enhancing the properties of the SAC305-soldered joint: heat treatment of the nickel-plated copper substrate before reflow soldering
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
https://doi.org/10.1007/s10854-021-07545-3
Copy DOIPublication Date: Jan 17, 2022 | |
Citations: 7 |
Enhancing the properties of the SAC305-soldered joint: heat treatment of the nickel-plated copper substrate before reflow soldering
Join us for a 30 min session where you can share your feedback and ask us any queries you have