Abstract
Alumina-reinforced copper matrix composites with Ag addition were fabricated by internal oxidation. The effects of slight Ag addition (0.92 at%) on electrical conductivity (EC) and oxidation resistance of internal-oxidized copper alumina composites were investigated. The annealing treatments were carried out to promote the diffusion of Ag in copper matrix. Ag was observed to segregate at Cu/Al2O3 interface after being annealed, which may lead to the lower interfacial energy between Al2O3 and copper matrix. The EC increased more than 7.8% after Ag was added. Moreover, annealing CuAl2O3Ag composite at 500 °C for 10 h results in the improvements of both oxidation resistance and EC. The initial oxidation temperature increased from 169 °C to 189 °C and the EC increased from 81.98 ± 0.56% International Annealed Copper Standard (IACS) to 88.19 ± 0.27%IACS. While the EC of CuAl2O3 composites always remained ∼76%IACS which suggests that the annealing treatment has insignificant impacts on EC of CuAl2O3 without Ag.
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