Abstract
The creep phenomenon is considered as one of the most important deformation mechanisms under working conditions. The present study has examined the microstructure and creep properties of Sn-9.0Zn-0.5Al solder alloy after adding a small amount of Antimony (Sb). Nominal compositions of Sb additions were chosen to be 0, 0.5, 1.0, and 1.5 wt.%. The minimum strain rate was reduced for the Sb containing solder alloy. The stress exponents, n, were found to be around 3.7 for all soldiers at 130°C. The stress exponent increases as the temperature drops from 100°C to 50°C, except for the 1.0% Sb alloy, where n 5.3 - 6.1 at all the temperature range (T = 50°C, 100°C and 130°C). The results reveal that the Sb-containing solder alloys have better creep resistance with greater ductility than the Sb-free alloy due to solid solution strengthening, and intermetallic compound SnSb particle hardening.
Highlights
Sn-9Zn eutectic alloy has been considered as one of the candidate that can be replaced the Sn-37Pb solder without increase of the operating temperature
The results reveal that the Sb-containing solder alloys have better creep resistance with greater ductility than the Sb-free alloy due to solid solution strengthening, and intermetallic compound SnSb particle hardening
Similar microstructures are observed in some Lead-free solder alloys at earlier solidification rates of 12 ̊C/s and 10 ̊C/s in studies [17]
Summary
Sn-9Zn eutectic alloy has been considered as one of the candidate that can be replaced the Sn-37Pb solder without increase of the operating temperature. They proposed that SnSb particle might be initially formed and dispersed in the molten solder to increase the nucleation rate and refine the grain size It is further found in tensile tests that mechanical properties are improved when the solder matrix is evenly dispersed with intermetallic compound (IMC) and SbSn particles [15] [16] [17] [18] [19]. Our group reveled that adding a small amount of Sb to the Sn-9Zn0.5Al system refined the bulky needles of Zn as well as β-Sn matrix It improved strengthen by solid solution hardening mechanism [3]. The creep tests were performed under constant applied stresses ranging from 15.6 to 29.3 MPa at constant temperatures of 50 ̊C, 100 ̊C, and 130 ̊C
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