Abstract
Many electroforming microstructures need their substrates to be bonded with electroforming layers in micromanufacturing. A controlling current density method to improve the adhesion performance of the copper substrate to the nickel electroforming layer was presented. Lower direct current density was employed to activate the substrate. A scratch test was conducted to evaluate the adhesion strength quantitatively by observing the friction load versus the normal load and the scratch track using a digital microscope. The experimental results indicated that electrochemical activation occurred on the cathode surface with an initial current density of between 0.2 and 1.0 A/dm2. The adhesion performance of the activated substrate to the nickel layer was higher than that of a substrate without activation. While the direct current density was 0.4 A/dm2, the adhesion strength was the highest. Electrochemical activation at the beginning of microelectroforming can enhance the adhesion strength of microstructures.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.