Abstract

ABSTRACTIn the continuing thrust to extend Moore's law, silicon is beginning to confront several issues that require innovative materials solutions to increase transistor and interconnect speeds while dealing with the increasing thermal loads of advanced microprocessors. The unsurpassed thermal and mechanical properties of diamond can be profitably exploited to enhance the performance characteristics of silicon based circuits. The discussion focuses primarily on the integration of diamond with silicon for the manufacture of silicon on diamond (SOD) wafers for spreading heat from hot spots in microprocessors. Other interesting property combinations are also presented as food for thought regarding other possible enhancements to silicon device performance. Recent data and prognosis for the future will be presented.

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.