Abstract
Significant performance and reliability challenges exist for high temperature electronics used in many applications, including those used in down-hole, under-bonnet, well-logging and aero-engine applications. Under high temp operating environments, the life expectancy of electronic components and systems reduces exponentially if they are not designed, packaged and protected appropriately to tolerate or negate the impact of high temperatures. This presentation highlights specific materials and conformal coating issues that play a significant role in addressing above challenges and presents results of thermal aging effects on Parylene HT at 250°C and up to 450°C. In addition, it provides an in-depth analysis of its performances at high temperatures and offers solutions to some existing issues through incorporating Parylene HT in the design and final protection of high temperature electronics.
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More From: Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)
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