Enhancing high-temperature tensile properties of Ni/Ni-W laminated composites for MEMS devices

Abstract

There is an increasing demand for materials with excellent mechanical performance for Micro-Electro-Mechanical System (MEMS) devices serving at elevated temperatures. However, how to enhance the high-temperature strength of the materials without losing their plasticity is a pending problem. Here, the Ni/Ni-W laminated composites with different monolayer thicknesses and the same ratio of the constituent layer thicknesses were fabricated successfully by using the dual-bath electrodeposition technique. The microstructure stability and tensile properties of annealed Ni/Ni-W laminated composites with different monolayer thicknesses were investigated at 400 °C. The results show that the annealed Ni0.5/Ni-W0.05 laminated composites have both high yield strength (450 MPa) and excellent elongation to failure (25.1%) at 400 °C, being superior to that of the monotonic Ni (179 MPa and 17.7%). Such a high strength of the laminated composite at 400 °C results from the contribution of the intrinsically high strength of the Ni-W layers with excellent thermal stability, the thickness-constrained effect on grain growth of Ni layers and the interface coupling effect of heterogeneous structures. The good plasticity may be derived from the heterogeneous laminated structure and the decrease in the constituent layer thickness, providing a good co-deformation ability. Basic mechanisms for the high tensile strength and good plasticity of the Ni/Ni-W laminated composites at 400 °C were analyzed theoretically. The findings reveal a potential strategy to fabricate MEMS components with excellent high-temperature tensile properties through tailoring the microstructure thermal stability and the constituent layer scale.