Abstract
The surface mechanical attrition treatment (SMAT) process was applied to pure Cu at both cryogenic and room temperatures. The cryogenic SMAT process resulted in a 60% reduction of grain size in the polycrystalline microstructure compared to that at room temperature. The level of grain refinement is related to a transition in the dominant deformation mechanism during SMAT from a dislocation-mediated behavior at room temperature to a twinning/shear band-mediated behavior at cryogenic temperatures, which also helps to suppress thermally activated processes.
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