Abstract
Adhesives with exceptional strength and long-lasting durability are of paramount importance in various industries and applications by providing efficient bonding solutions, enabling the assembly of diverse materials. However, enhancing the adhesion strength of photocurable adhesives poses a significant challenge due to the presence of shrinkage stresses. In this work, upconversion particle-assisted near-infrared photopolymerization (UCAP) was used to cure adhesives, and the effects of curing condition, such as irradiation time and particles content, on adhesive properties were investigated. The adhesives cured through UCAP demonstrated a notable enhancement in shear strength, with an observed increase of approximately 25 % compared to the specimens cured by UV irradiation. Through a comprehensive analysis of the shrinkage deformation and rheological behavior during curing, this study successfully demonstrated the effects of UCAP in reducing shrinkage stress and alleviating the peeling tendency. Moreover, the reduced deformation of UCAP specimens compared to UV-cured specimens can be attributed to the increased gel point conversion in the UCAP process. The improved adhesive properties observed through UCAP indicates the potential for widespread utilization of UCAP technology.
Sign-in/Register to access full text options 
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
