Abstract
The surface of no-flow prepreg for multilayer structure of printed circuit boards was modified with O2/CF4 plasma to improve the adhesion between copper foil and epoxy matrix in prepreg. Morphology and chemical composition of prepreg surface were measured by scanning electron microscopy and X-ray photoelectron spectroscopy, respectively. Effect of plasma modification time on roughness, wettability and adhesive performance were investigated by the tests on laser roughness, water contact angle and peel strength. The results indicated that peel strength between prepreg and copper foil achieved the maximum when modification time of plasma reached 20min.
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