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Abstract
This research study the effect of surface modification and copper (Cu) plating carbon fiber (CF) surface on the thermal stability and wettability of carbon fiber (CF)/epoxy (EP) composites. The TGA result indicates that the thermal-stability of carbon fiber may be enhanced after Cu coating CF. TGA curve showed that the treatment temperature was enhanced thermal stability of Ep/CF, this is due to the oxidation during heating. The Cu plating increased the thermal conductivity, this increase might be due to reduce in contact resistance at the interface due to chemical modification and copper plating and tunneling resistance.
 The increase of surface polarity after coating cause decrease in the value of contact angle. As well as the increase of CuO as a function of the heat temperature cause the rapid contact angle decrease and can strongly enhance the wettability.
Highlights
Carbon fiber/polymer composite (CFPC) materials are used in many technological industries because of their low density, high strength to weight ratio and high stiffness [1]
The elemental composition of the deposit was verified by energy dispersive X-ray (EDX) spectroscopy Fig
thermogravimetric analyzer (TGA) curves showed that the treatment temperature enhanced thermal stability of Ep/carbon fiber (CF), this is due to the oxidation during heating [12]
Summary
Carbon fiber/polymer composite (CFPC) materials are used in many technological industries because of their low density, high strength to weight ratio and high stiffness [1].Many of the research conducted in the field of improving the properties of composites focused on improving the properties of the base material (matrix) [2]. After Cu electroless coating, the carbon fiber showed a contact angle of 82o.
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