Abstract
Phase-separated polymer blend composite films exhibiting high thermal diffusivity were prepared by blending a soluble polyimide (BPADA-MPD) and a bismaleimide (BMI) with needle-shaped zinc oxide (n-ZnO) particles followed by high-temperature curing at 250 °C. Images recorded with a field-emission scanning electron microscope (FE-SEM) equipped with wavelength-dispersive spectroscopy (WDS) demonstrated that the spontaneously separated phases in the composite films were aligned along the out-of-plane direction, and the n-ZnO particles were selectively incorporated into the BMI phase. The out-of-plane thermal diffusivity of the composite films was significantly higher than those of the previously reported composite films at lower filler contents. Based on wide-angle X-ray diffraction (WAXD) patterns and image analysis, the enhanced thermal diffusivity was attributed to the confinement of the anisotropically shaped particles and their nearly isotropic orientation in one phase of the composite films.
Highlights
The minimization and advanced performance of state-of-the-art electronic devices urgently require improvements in heat dissipation from electronic components loaded on flexible printed circuit boards
We demonstrated that the degree of orientation of anisotropic, platelet-shaped fillers in a composite film is nearly proportional to the anisotropy of thermal conductivity of composite films [2], controlling the orientation of anisotropic fillers is key to Polymers 2017, 9, 263 the out-of-plane thermal conductivity
In thermal conductivity of composite films [2], controlling the orientation of anisotropic fillers is key to addition, the two phases of poly(amic acid)s (PAAs) were separately aligned along the out-of-plane direction during enhancingdrying the out-of-plane thermal conductivity
Summary
The minimization and advanced performance of state-of-the-art electronic devices urgently require improvements in heat dissipation from electronic components loaded on flexible printed circuit boards. In thermal conductivity of composite films [2], controlling the orientation of anisotropic fillers is key to addition, the two phases of PAAs were separately aligned along the out-of-plane direction during enhancingdrying the out-of-plane thermal conductivity. Randomized by the confinement the by mixing poly(amic acid)sthe (PAAs) of BPDA-TFDB and BPDA-SDA (SD) effect, with and needle-shaped nearly isotropic orientation of the n-ZnO particles significantly enhanced the thermal conductivity in. Since more n-ZnO the ratio of the amounts of components Using this blend system, the fillers could be further confined, particles were selectively incorporated into the TF phase (matrix phase) of the blend composite film, the and the anisotropic fillers could be partly aligned along the out-of-plane direction of the composite orientation of the fillers was by thenew confinement effect,blend andcomposite the nearly isotropic orientation films.
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