Abstract
According to the infrared stealth mechanism, combining the low emissivity material and temperature control material is an effective way to improve the infrared stealth performance. In this paper, ultra-high molecular weight polyethylene (UHMWPE)-based multilayer composites with low emissivity and thermal conductivity are prepared through the combination of the low emissivity layers and the thermal insulation layers. The infrared stealth performance of the composites is varied by changing the layer numbers and the thickness of the functional layers as well as the structural design. And the orientation of the low emissivity fillers is realized to further reduce the emissivity of the low emissivity layers. The infrared emissivity of the low emissivity layer is as low as 0.297 and 0.247 at 3–5 μm and 8–14 μm, respectively, which is 25.9% and 46.4% lower than that before modification. The surface temperature of the multilayer sample reaches 26.8 °C after being placed on a 60 °C hot stage for 30 min, exhibiting excellent infrared stealth performance. Meanwhile, the density of the sample is 0.48 g/cm3, and the thickness is 2.8 mm, which is permissible for the infrared stealth applications.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
