Abstract
We study fabrication process and design opportunities for shrinking the “dead zones” in large-scale mosaic microbolometer detector arrays (MBDAs) for the infrared and terahertz regions. We perform a quantitative analysis of dead zones in mosaic photodetectors and describe the technology achievable by densely packing submodule chips into mosaic MBDAs with dead zone widths of 13–22 μm. We have also developed address-circuit designs that minimize dead zone widths in mosaic MBDAs.
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