Abstract
We proposed a new approach to improve the thermal stability of sintered Ag joints on bare Cu substrates. In the sintering process, Ag-Sn intermetallic compounds (IMCs) formed at the edges of sintered joints that could inhibit the penetration of oxygen and the microstructural coarsening behaviour of sintered Ag. Cu-Sn and Ag-Sn IMCs formed at the bottom of the joints simultaneously. This IMC barrier hindered the diffusion of Cu atoms towards the sintered Ag layer and the formation of Cu oxides effectively. A high-temperature (300 ℃) storage test in air demonstrated that the shear strength of this kind of joint maintained above 60 MPa for 1000 h.
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