Abstract
Optimization for heat dissipation plays a significant role in energy saving and high-efficiency utilizing of integrated electronics. In this paper, we present a study of micro structuring on polymer-based flexible substrate coupled with aluminum-alloy heat sink. The heat dissipation performance was investigated by temperature evolution of a heat sink under natural convection by infrared (IR) camera, and results showed that the heat dissipation enhancement could be up to 25%. Moreover, the heat dissipation performance of a typical heat sink in terms of light-emitting diode (LED) hip was investigated via both thermal transient measurement and the finite element analysis (FEA). The maximum LED chip temperature of the laser-textured heat sink was approximately 22.4% lower than that of the as-received heat sink. We propose that these properties accompanied with the simplicity of fabrication make laser surface texturing a promising candidate for on-chip thermal management applications in electronics.
Highlights
Heat dissipation has become an important challenge for rapid development of modern electronic devices due to energy consumption and utilizing performance [1,2,3,4,5]
Yu et al [16] investigated natural convection heat transfer around a radial heat sink adapted for dissipating heat on a circular light-emitting diode (LED), and found that as the number of surface patterns increased, the thermal resistance and average heat transfer coefficient decreased
To verify cooling performance of the laser-textured polyethylene terephthalate (PET) heat sink, three types of natural convection cooling devices for LED chips were produced on basis of as-received, micro-grooved and micro-gridded
Summary
Heat dissipation has become an important challenge for rapid development of modern electronic devices due to energy consumption and utilizing performance [1,2,3,4,5]. Surface structures have been considered as an effective way to enhance heat transfer properties under natural convection [7,14]. Yu et al [16] investigated natural convection heat transfer around a radial heat sink adapted for dissipating heat on a circular LED, and found that as the number of surface patterns increased, the thermal resistance and average heat transfer coefficient decreased. Investigated the effects of substrate materials, coolants, and geometric parameters on temperature distribution and thermal resistance of the double-layered microchannel heat sink, showing an average increasing of 6.3% of thermal performance. Most of surface structures were fabricated on either Si or metal substrate, which limited further application in flexible electronic devices. Metal-polymer composite heat sink with textured PET was designed, and natural convection heat transfer properties were studied. Our results offer a new lightweight and effective metal-polymer composite heat sink, which is an alternative of large and heavy metal coolers
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