Abstract
In this letter, an enhanced transmission structure with high-directivity radiation through a single slit in a 1.5-mm-thick Teflon circuit board material surrounded by arrays of parallel metallic patches and via-holes is reported. The proposed structure is based on the composite right/left-handed transmission-line microstrip technology. The radiation principle is analyzed by employing transmission-line dispersion relation. High-directivity radiation is observed at the frequency where enhanced transmission occurs. The experimental results are consistent with the theoretical prediction.
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