Abstract
Epoxy–clay nanocomposites, HDTMA–BDGE, HDTMA–BPDG, HDTMA–BBDG, HDTMA–TGDDM and HDTPP–BDGE were synthesized using hexadecylammonium clay and hexadecylphosphonium clay, respectively. The Montmorillonite (MMT) clay was modified with quaternary ammonium salt and with triphenylphosphonium salt which was intercalated into the interlayer region of MMT-Clay. The epoxy–clay systems were cured by using diaminodiphenylsulphone as a curing agent. The X-ray diffraction patterns obtained for the systems confirmed the nanodispersion of MMT-Clay in the epoxy networks. The ammonium clay-modified systems displayed appreciable mechanical and glass-transition temperature properties while, the phosphonium clay-modified system exhibited highest thermal resistance properties compared with unmodified epoxy systems. The T g decrease observed in all the clay-modified epoxy systems, may be compromised with their advantage of requiring the filler content very low (5wt%), when compared to the conventional epoxy systems whose filler quantity is normally required from 25 to 30 wt%.
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