Abstract
Internal Y-shaped bifurcation has been proved to be an advantageous way on improving thermal performance of microchannel heat sinks according to the previous research. Metal foams are known due to their predominate performance such as low-density, large surface area, and high thermal conductivity. In this paper, different parameters of metal foams in Y-shaped bifurcation microchannel heat sinks are designed and investigated numerically. The effects of Reynolds number, porosity of metal foam, and the pore density (PPI) of the metal foam on the microchannel heat sinks are analyzed in detail. It is found that the internal Y-shaped bifurcation microchannel heat sinks with metal foam exhibit better heat transfer enhancement and overall thermal performance. This research provides broad application prospects for heat sinks with metal foam in the thermal management of high power density electronic devices.
Published Version
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