Abstract
The thermal diffusivity along the out-of-plane direction (D⟂) in polyimide (PI) blend films containing silver nanoparticles (Ag-NPs) was investigated. PI blend films composed of a sulfur- and a fluorine-containing PI were prepared via spin-coating and thermal curing of the precursor solutions dissolving silver nitrate. Micro-phase-separated structures with a “vertical double percolation (VDP)” morphology were spontaneously formed in the films, in which two phases are separately aligned along the out-of-plane direction, and Ag-NPs were preferentially precipitated in the sulfur-containing PI phase. The blend films exhibited higher D⟂ values than monophase PI films containing homogeneously dispersed Ag-NPs. These results indicate that the VDP structure functions as an effective thermal conductive pathway.
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