Abstract
In this study, we demonstrate the use of silicone/few-layered hexagonal boron nitride (FL-hBN) composites for heat dissipation applications. FL-hBN is synthesized via a green, facile, low-cost and scalable liquid exfoliation method using a jet cavitation process. The crystal structures, surface morphologies and specific surface areas of pristine h-BN and FL-hBN were characterized by XRD, SEM, TEM and AFM (atomic force microscopy). The results confirmed that FL-hBN with a thickness of ~4 nm was successfully obtained from the exfoliation process. In addition, we introduced both pristine h-BN and FL-hBN into silicone with different ratios to study their thermal properties. The results of the laser flash analysis indicate that the silicon/FL-hBN composite exhibited a higher thermal conductivity than that of the silicone/h-BN composite. With the optimal loading content of 30 wt.% FL-hBN content, the thermal conductivity of the composite could be enhanced to 230%, which is higher than that of silicone/h-BN (189%). These results indicate that jet cavitation is an effective and swift way to obtain few-layered hexagonal boron nitride that could effectively enhance the thermal conductivity of silicone composites.
Highlights
In recent decades, heat dissipation has been one of the most critical challenges in current high-density and high-power electronic products due to rapid developments in the miniaturization of microelectronic devices
The results indicate that the thickness of the hexagonal boron nitride (h-BN) was ~500 nm (Figure 4a), which is much thicker than that of the few-layered hexagonal boron nitrides (FL-hBN)
The results showed that both thermal diffusivity and thermal conductivity increased with the increasing content of the fillers
Summary
Heat dissipation has been one of the most critical challenges in current high-density and high-power electronic products due to rapid developments in the miniaturization of microelectronic devices. It is well known that some potential fillers with high thermal conductivity material, such as graphene [5,6], metal particles [7,8], aluminum nitride (AlN) [9,10], alumina (Al2 O3 ) [11,12] and silicon carbide (SiC) [13,14], have been reported. Fan et al demonstrated a novel approach to fabricate boron nitride nanosheets (BNNS) via hypochlorite-assisted ball milling This method involves the synergetic effects of chemical peeling and mechanical shear forces, which can improve the yield and dispersion [32]. In the thermal property analysis, the silicone composites with FL-hBN showed a much higher thermal conductivity than that of the h-BN/silicone composite in the same loading weight
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