Abstract
The rapid development of chip technology has all put forward higher requirements for highly thermally conductive materials. In this work, a new type of material of Fishbone-like silicon carbide (SiC) material was used as the filler in a polyvinylidene fluoride (PVDF) matrix. The silicon carbide/polyvinylidene fluoride (SiC/PVDF) composites were successfully prepared with different loading by a simple mixing method. The thermal conductivity of SiC/PVDF composite reached 0.92 W m−1 K−1, which is 470% higher than that of pure polymer. The results show that using the filler with a new structure to construct thermal conductivity networks is an effective way to improve the thermal conductivity of PVDF. This work provides a new idea for the further application in the field of electronic packaging.
Highlights
Wang et al enhanced the thermal conductivity of carbon fiber/polymer composites through silicon carbide (SiC) nanowires/graphene hybrid nanofillers [24]
The thermal conductivity of the polymer composites with 3.0 wt% filler content reached 0.45 W m−1 K−1, which is approximately a 106% enhancement compared with pure epoxy [31]
5a, the thermal diffusivity and thermal conductivity of SiC/polyvinylidene fluoride (PVDF) composites both increase with the increasing of filler content, which increased from 0.11 to 0.54 mm2/s and Figure 5 demonstrates the enhancement of thermal transportation performance of polymer composites by adding Fishbone-like SiC fillers with different loadings
Summary
Publisher’s Note: MDPI stays neutral with regard to jurisdictional claims in published maps and institutional affiliations. With the continuous advancement of chip technology, high frequency and power gradually become the developing direction of integrated electronic devices This trend causes more waste heat, which is generated from its limited volume. Polyvinylidene fluoride (PVDF) is a thermoplastic polymer with comprehensive properties, such as excellent mechanical strength, thermal stability, chemical stability, and Nanomaterials 2021, 11, 2891. The thermal conductivity of the polymer composites with 3.0 wt% filler content reached 0.45 W m−1 K−1 , which is approximately a 106% enhancement compared with pure epoxy [31]. Wang et al used hexagonal silicon boron (hBN) nanosheets and functionalized silicon carbide (f-SiC) nanowires to prepare PVDF dielectric composites in the same way, and its thermal conductivity reaches 1.41 W m−1 K−1 [34]. Fishbone-like SiC fillers were added into PVDF to prepare a polymer composite by blending and hot-pressing
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