Abstract
AbstractThe present work focuses on fabricating a flexible and thermally conductive PI composite film. The PI composite film was obtained by blending hexagonal boron nitride (h-BN) combined with ethyl cellulose and 2,2’-Bis(trifluoromethyl) benzidine (TFMB) functionalized GO (TFMB- GO) in polyimide (PI). The ethyl cellulose successfully formed the thermal conduction network by promoting the dispersion of h-BN in PI matrix. Thus, the thermal conductivity of the PI composite film with ethyl cellulose could be twice than PI film without ethyl cellulose. Besides, the PI composite film containing 30 wt% of h-BN could still exhibit excellent flexibility. Moreover, the combination of TFMB-GO could increase the tensile strength of the PI composite film by up to 80%. Overall, we provided a novel idea for the preparation of flexible substrate materials with efficient heat dissipation which was convenient and possible to apply widely in the industrial production.
Highlights
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The addition of TFMB-graphene oxide powder (GO) contributed to the further improvement of the tensile strength of PI composite film, which could be applied in the heat dissipation of electronic packaging and substrates
As for h-BN_EC/PI composite film, the introduction of ethyl cellulose increased the tensile strength of the PI composite film significantly
Summary
The h-BN powder (99%) was purchased from CWNANO Co., Ltd, China. The 4,4’-diaminodiphenyl ether (ODA, 98.5%), pyromellitic dianhydride (PMDA, 99%), 2,2’-Bis(trifluoromethyl) benzidine (TFMB, 98.0%), N-Methyl pyrrolidone (NMP, ≥99.9%) and N,N-Dimethylformamide (DMF, 99%) was provided by SINOREAGENT Co., Ltd, China. Graphene oxide powder (>99%) was obtained from XFNANO Co., Ltd, China. Ethyl cellulose (EC, CP, 1.14 g/mL at 25°C) was from MACKLIN Co., Ltd, China
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