Enhanced thermal conductivity of epoxy composites with core‐shell SiC@SiO2nanowires

Abstract

Electronic packaging materials and thermal interface materials (TIMs) are widely used in thermal management. In this study, the epoxy composites with core-shell structure SiC@SiO2 nanowires (SiC@SiO2 NWs) as fillers could effectively enhance the thermal conductivity of epoxy composites. The unique structure of fillers results in a high thermal conductivity of epoxy composites, which is attributed to good interfacial compatibility epoxy matrix and bridging connections of SiC@SiO2 NWs. From neat epoxy to 2.5 wt% loading of SiC@SiO2 NWs, the thermal conductivity is significantly increased from 0.218 to 0.391 W m−1 K−1, increased by 79.4%. In addition, the composite with 2.5 wt% filler possess lower coefficient of thermal expansion and better thermal stability than that of neat epoxy. All these outstanding properties imply that epoxy/SiC@SiO2 NWs composites could be the ideal candidate for TIM.