Abstract
Preparation of polymer-based packaging materials with rapid heat dissipation capacity is crucial for ensuring high-power equipment’s service life. To achieve this, boron nitride (BN) and multi-walled carbon nanotubes (MWCNTs) were used in different ratios to prepare thermally conductive epoxy composites. These composites were created through a simple mixing and curing process, resulting in a heat transmission path. Then, BN and MWCNTs were separately functionalized with dopamine and acid to enhance their dispersibility and interfacial compatibility within the epoxy resin. This was done to further explore their influence on the formation of serial heat transfer pathways. The BN/MWCNTs/epoxy composites with a filler ratio of 15:1 and a total filler loading of 30 wt % exhibited a thermal conductivity of 0.92 W/mK, which is 118% higher than pure epoxy. These composites also displayed favorable mechanical properties and thermal stability. This study provides guidance for designing high-performance epoxy composites to meet modern electronic devices’ thermal management requirements.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
