Abstract
A cost-efficient and practical strategy was developed for preparing high thermal conductive epoxy packaging composites. The effective conductive network was constructed by the bridging effect between boron nitride (BN) and spherical silica (SiO2). Compared to the epoxy (EP) composites with randomly dispersed BN and SiO2, the EP/SiO2@BN showed a great enhancement in thermal conduction. The thermal conductivity of EP/SiO2@BN reached to 0.86 W m−1 K−1 with 60 wt% content of hybrid filler, which was 91% higher than that of EP/SiO2 samples and was around 12% higher than that of epoxy composites with unmodified BN and SiO2. In addition, the EP/SiO2@BN exhibited lower thermal interface resistance in comparison with EP/SiO2&BN composites according to the effective medium theory (EMT). The encapsulation of BN on the surface of SiO2 greatly enhanced the thermal transfer efficiency of the epoxy matrix and showed great potential in the epoxy packaging practical application.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
