Enhanced thermal conductivity and mechanical properties of epoxy resin-alumina-silicon carbide fibers three-phase composites

Abstract

Epoxy resin composites with high thermal conductivity have received a great deal of attention both in science and engineering. However, improving thermal conductivity usually relies on introduction of thermally conductive inorganic particles, which will inevitably decrease their mechanical strength. Here, we report a three-phase composite material with epoxy resin as matrix and both alumina (Al 2 O 3 ) particles and silicon carbide fibers (SiCf) as fillers. The composites exhibited high and anisotropically thermal conductivity that the in-plane and through-plane values reached 1.55 and 0.50 W/ (m K), respectively. Furthermore, the addition of SiCf led to improved mechanical properties and excellent thermal stability. This approach will guide the design of high-performance polymer composites with high thermal conductivity and meanwhile excellent mechanical properties.