Enhanced thermal conductive 3D-SiC/Al-Si-Mg interpenetrating composites fabricated by pressureless infiltration

Abstract

A high thermal conductive 3D-SiC/Al-Si-Mg interpenetrating composite (IPC) with three dimensional mutually interpenetrated structure was fabricated by mold-forming and pressureless infiltration method. Al-15Si-10Mg was used as the infiltration aluminum alloy. The obtained composite was treated with a T6 procedure. The composed phases, microstructure, thermal conductivity, mechanical strength and fractography of the prepared 3D-SiC/Al-Si-Mg IPC were either analyzed or measured with X-ray diffraction (XRD), optical metallography, laser thermal conductivity instrument, universal testing machine, field emission electron scanning microscopy (SEM) with energy dispersive spectroscopy (EDS), high-resolution transmission electron microscopy (HRTEM), and etc. The results showed that both SiC ceramic and aluminum alloy phases distribute evenly and form a three-dimensional mutually interpenetrated structure in the obtained IPC. No clear brittle and harmful Al4C3 phase was found in the composite. The obtained IPC contains a SiC volume fraction of 67vol% and has the properties of a density of 3.02g/cm2, a thermal conductivity of 233.6W/(m°C), a thermal expansion coefficient (RT~300°C) of 7.03×10−6/°C and a bending strength of 288MPa.