Enhanced the Thermal Conductivity of Polydimethylsiloxane via a Three-Dimensional Hybrid Boron Nitride@Silver Nanowires Thermal Network Filler.

Zhengqiang Huang,Zhengyi Wang,Yi Wang,Dietmar Drummer,Chao Liu,Wei Wu

doi:10.3390/polym13020248

Zhengqiang Huang, Zhengyi Wang + Show 4 more

Open Access

https://doi.org/10.3390/polym13020248

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Abstract

In this work, polydimethylsiloxane (PDMS)-based composites with high thermal conductivity were fabricated via a three-dimensional hybrid boron nitride@silver nanowires (BN@AgNWs) filler thermal network, and their thermal conductivity was investigated. A new thermal conductive BN@AgNWs hybrid filler was prepared by an in situ growth method. Silver ions with the different concentrations were reduced, and AgNWs crystallized and grew on the surface of BN sheets. PDMS-based composites were fabricated by the BN@AgNWs hybrid filler added. SEM, XPS, and XRD were used to characterize the structure and morphology of BN@AgNWs hybrid fillers. The thermal conductivity performances of PDMS-based composites with different silver concentrates were investigated. The results showed that the thermal conductivity of PDMS-based composite filled with 20 vol% BN@15AgNWs hybrid filler is 0.914 W/(m·K), which is 5.05 times that of pure PDMS and 23% higher than the thermal conductivity of 20 vol% PDMS-based composite with BN filled. The enhanced thermal conductivity mechanism was provided based on the hybrid filler structure. This work offers a new way to design and fabricate the high thermal conductive hybrid filler for thermal management materials.

Highlights

With the gradual development of micro-miniaturization, high integration density, high power, and multi-function in electronic and electrical industry, the heat accumulation in the field of electronic packaging has become a serious problem [1,2]
The results showed that the thermal conductivity of BN@15AgNWs/PDMS is higher than that of BN/PDMS significantly
The SEM images of AgNWs and BN hybrid fillers with different mass ratios are shown in Figure 2, AgNWs can be seen on the surface and the periphery of BN, and they have a better dispersion state at low feed ratios

Summary

Introduction

With the gradual development of micro-miniaturization, high integration density, high power, and multi-function in electronic and electrical industry, the heat accumulation in the field of electronic packaging has become a serious problem [1,2]. It is necessary to design and prepare high conductivity thermal interface materials to eliminate the accumulated heat [5]. Inspired by three-dimensional constructed structure, a new type of hybrid boron nitride@silver nanowires (BN@AgNWs) thermal network filler was designed and fabricated by in situ growth method here. The results showed that the thermal conductivity of BN@15AgNWs/PDMS is higher than that of BN/PDMS significantly This is mainly due to the good compatibility between the silver nanowires and PDMS matrix, and the “silver bridge” formed by connecting the silver nanowires between the boron nitride sheets optimizes the three-dimensional heat conduction network. This work can offer a new idea to design and fabricate the high thermal conductive composites

Materials

Characterization

Results and Discussion

Schematic

Conclusions