Enhanced terahertz imaging of electronic packaging materials with deconvolution algorithm

Abstract

This paper proposes the deconvolution image restoration algorithm, which uses the point spread function constructed by the physical characteristics of the terahertz beam to reconstruct the terahertz image and improve the image resolution[1]. At the same time, by constructing a point spread function with different penetration depths in the sample, the effect of image chromatogram on the sample can also be achieved. The integrated circuit (IC) electronic package terahertz imaging results clearly show the spatial position of the pins, internal chips and defects of the electronic packages, and analyze a variety of failure defect types, which are <1% more than the actual size.