Enhanced solder joint bonding strength of electronic packaging with electrowetting effect

Abstract

This paper reports a novel method to enhance solder ball or solder ring bonding strength by using electrowetting-on-dielectric (EWOD) effect. With a low melting point, the metal Sn has been widely used in electronic packaging technology. Since Sn will be molten into liquid when the temperature is increased above the melting point, the method for treating liquid can be herein employed. Contact angle of the molten Pb-free balls or ring structure on silicon substrate have been experimentally changed by applying electric field across the thin dielectric film between the molten solder and the conductive silicon substrate. The contact area between the solder and the substrate is enlarged due to the decrease of the contact angle. Our testing results on the EWOD enhanced packaging structures of solder balls, flip-chip and solder ring hermetic package generally show about 50% enhancement in bonding shear strength. The significantly enhanced solder link bonding strength is hopeful for improving packaging reliability and is promising to be used in high performance silicon based electronic or microelectromechanic SiP (system in package) technologies.