Abstract
Interfacial reactions of Ni micro cones with Sn at solid state temperatures from 373 K to 473 K were studied and compared with Sn/flat Ni diffusion couples. Due to its morphological characteristics, cone-structured Ni enhanced the nucleation of Ni3Sn4, resulting in thicker Ni3Sn4, which is also smaller in grain size and different in texture. At lower annealing temperatures (<423 K), cone-Ni also strongly suppresses the nucleation of metastable NiSn3. The stripe-like micromorphology and special texture of Ni cones are believed to be the reasons for enhanced Ni3Sn4 nucleation.
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