Enhanced Mechanical Properties with Ag Addition in Electroplated Ni-Sn Solder Joints: Sub-10 Micron Bond Thickness

Abstract

Keywords: Micro-bump; Microstructure; Intermetallic compounds; Mechanical properties; thermocompression bondingThe advancement of electronic devices has garnered more extensive attention towards three-dimensional integrated circuit (3D-IC) technology due to microbump size reduction and increased power density. Microbumps play an important role in driving the development of this technology, especially in 3D chip-stacking involving multiple reflow processes. The reduction in microbump height spotlights the presence of intermetallic compounds (IMCs). In comparison to traditional ball grid array (BGA) solder joints, microbumps with smaller solder volumes exhibit a predominant fraction of IMCs at solder joints, especially with microbump dimensions potentially shrinking to less than 10 micrometers.The interface reaction within confined spaces has become a critical concern. Mechanical properties will be dominated by IMC properties rather than solder characteristics. In conventional Cu/Sn/Cu solder joints, grain coarsening and prolonged reflowing times, which result in IMC collisions from opposing substrates, forming columnar grains with a uniform orientation, make the solder joint less reliable. Furthermore, the Cu3Sn layer in Cu/Sn/Cu microbumps presents another challenges, indicating the formation of Kirkendall voids, increasing the risk of brittle interface fractures.This study investigates the mechanical reliability and microstructure of two sub-10um sandwiched structures: Cu/Ni/Sn/Ni/Cu and Cu/Ni/Sn-3.5Ag/Ni/Cu. In the 3D-IC manufacturing process, solder joints will experience multiple reflow processing. Different reflow heat treatment process to achieve different fractions of Ni3Sn4 IMCs were performed on both sandwiched structure. Despite the formation of internal voids due to volume shrinkage in Ni/Sn solder joints, the addition of silver in the solder, forming Ag3Sn, effectively fills these voids. The long-time reflowed sample showed outstanding mechanical properties via the addition of silver in solder. In this study, the influence of silver addition on the microstructure and mechanical properties of the overall joints under identical reflow conditions, the fracture path observation after shear test were investigated. The growth mechanism of Ag3Sn and its distribution in the solder would be further explored and addressed. Figure 1