Enhanced mechanical and dielectric properties of SiCf/SiC composites with silicon oxycarbide interphase

Abstract

SiCf/SiC composites with silicon oxycarbide (SiOC) interphase were successfully prepared using silicone resin as interphase precursor for dip-coating process and polycarbosilane as matrix precursor for PIP process assisted with hot mold pressing. The effects of SiOC interphase on mechanical and dielectric properties were investigated. XRD and Raman spectrum results show that SiOC interphase is composed of silicon oxycarbide and free carbon with a relatively low crystalline degree. The surface morphology of SiC fibers with SiOC interphase is smooth and homogeneous observed by SEM. The flexural strength and failure displacement of SiCf/SiC composites with SiOC interphase vary with the thickness of interphase and the maximum value of flexural strength is 289MPa with a failure displacement of 0.39mm when the thickness of SiOC interphase is 0.25µm. The complex permittivity of the composites increases from 8.8-i5.7 to 9.8-i8.3 with the interphase thicker.