Abstract
To reduce the risk of implant failure caused by “stress shielding” and bacterial infection, a porous Cu-bearing Ti-based BMG with high porosity (48.5%), hierarchical holes ranging from 0 to 600 µm in diameter and mechanical characteristics (162 MPa and 22.8 GPa) close to bone tissue was developed by a space holder method via SPS. With the aid of the space holder’s size effect, the porosity and strength of the BMG have been further improved under the low Young's modulus without triggering the “stress shielding”. Furthermore, the addition of porous structures increases the rate of Cu ion release and significantly improves the antibacterial activity of the porous BMG without destroying biocompatibility. Taken together, the porous Ti-based BMG shows great potential as an ideal substitute for natural bone.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
