Abstract
A Sn/Ni bilayer deposited on a Si substrate is subjected to tensile or compressive strain under three-point bending to investigate the Sn/Ni interfacial reactions under strain. Both tensile and compressive strains are found to have enhanced effects on the growth of the Ni3Sn4 phase which formed at the Sn/Ni interface when it was aged at 200 °C. When subjected to strains, the Ni layer exhibits significant microstructure evolution, which is suggested to play a crucial role in the enhanced growth of the Ni3Sn4 phase.
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