Abstract

Boron incorporation in 650 nm thick polycrystalline BaTiO3 films results in grain growth and dramatic dielectric response improvements. For levels between 0% and 3%, average grain size is increased from 150 to 200 nm and the maximum permittivity values are nearly doubled, with tunabilities increased to greater than 90% while maintaining high field loss tangents below 0.03. These results demonstrate a pathway for microstructure engineering and property optimization in refractory electroceramic oxide thin films without increasing the thermal budget.

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