Enhanced dielectric performance and thermal conductivity of the polyetherketoneketone composite films prepared via a facile template spray coating method

Abstract

Polyetherketoneketone (PEKK) is a specialized engineering plastic renowned for its exceptional strength, high temperature resistance and chemical resistance. However, the high melting point of PEKK restricts its processing methods to traditional techniques such as melt extrusion, hot pressing, and molding, significantly limiting its application in the field of microelectronic devices. In this study, a facile template spray coating method was proposed to prepare highly flexible PEKK films. Furthermore, functionalized boron nitride-carbon nanotube (BN-CNT) hybrid fillers were prepared and incorporated into the PEKK matrix. The results demonstrated that when the content of BN-CNT hybrid filler was 5 wt%, the dielectric constant of the composite film ranges from 2.2 to 1.8 in the frequency range of 100–200000 Hz, with a dielectric loss value below 0.03. When the content of the hybrid filler increased to 20 wt%, the enhanced thermal conductive network results in a 640% increase in thermal conductivity compared to pure PEKK. The enhanced thermal conductivity of the composite films promoted heat dissipation of the computer CPU and accelerated the cooling rate. These findings demonstrate the great potential of the PEKK composite films for diverse applications in microelectronic devices.