Enhanced Design and Reliability Analysis of Copper Post Wafer Level Package

Abstract

In this study, the board level reliability (BLR) performance of different copper (Cu) post wafer level package (WLP) structures without epoxy or molding encapsulation have been evaluated and compared to standard WLP. The Cu post WLP test vehicle has been performed on different stack up structures of 4.7 x 7.1 mm2 package size at 0.4 mm ball pitch. The Cu post bumps of test vehicles were manufactured through main-stream production technologies including standard ball drop and electro-plated lead free solder after Cu post completed. The Cu post WLP will enhance the risk of board level solder joint fatigue due to thick Cu post without encapsulation will increase bump site stress. The optimized design parameters of package stack up with low temperature cured polyimide are implemented to accommodate the increased stress. In this work, we also evaluated a novel Cu post WLP stack up structure for fast package cycle time and fine pitch application. The improved BLR performance of large die size Cu post WLP is demonstrated in this investigation. The failure modes analysis and Weibull failure statistics are presented for the BLR results and recommendations as to the preferred Cu post WLP structure are also included.