Enhanced copper–carbon nanotube hybrid conductors with titanium adhesion layer

Abstract

Cu–carbon nanotube (CNT) hybrids combine the advantages of the high electrical conductivity of Cu with the low temperature coefficient of resistance for CNTs, but require enhanced interfacing to improve the electrical performance when exposed to elevated temperatures. Herein, Ti and Ni were investigated as adhesion metals by thermally evaporating 10 nm layers onto a CNT conductor. SEM analysis shows Ni deposits as discrete nanoscale crystallites which coalesce after annealing to 400 °C in H2/Ar. Ti deposits uniformly along the CNT surface and is stable over such temperatures. A 100 nm deposition of Cu is shown to delaminate from the CNTs after annealing, and the resistance per length (R/L) increases by 40%. The Cu–Ni–CNT exhibits a 125% increase, while the Cu–Ti–CNT achieves a 12% decrease in R/L, for similar annealing conditions. Thus, Ti emerges as an effective adhesion metal, warranting its use in metal–CNT wire technologies for elevated temperature operation.