Abstract
A compact dumbbell shaped defected ground structure (DGS) is applied to reduce the mutual coupling between microstrip arrays elements for ISM band and wireless applications with 0.47 λ0 elements spacing. The dumbbell DGS with new distribution is inserted in the E-plane between the adjacent arrayscoupled elements to suppress the pronounced surface waves. A four-element array with dumbbell shaped DGS is designed, fabricated on a substrate with dielectric constant of 10.2 and thickness of 1.27mm, and measured. The results show that a reduction in mutual coupling of 35.6 dB is obtained between elements at the operation frequency of the array. The surface current distribution with and Without DGS for the array is discussed. The microstrip array with and without DGS are studied by the waveguide simulator method and fabricated by photolithographic technique.
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