Engineering the Atomic Interface of Refractory‐Metal‐Reinforced Copper Matrix Using Direct Ink 3D Printing

Abstract

Herein, 3D printing involving metallic materials with substantially distinct melting temperatures and their immiscibility presents a formidable challenge. Nevertheless, it may be possible to overcome this challenge using the direct ink writing (DIW) method within such immiscible systems. In this article, a successful fabrication of Cu‐based composites utilizing the additive manufacturing process that is DIW technique, followed by a post‐sintering process, is presented. The secondary addition to the Cu–matrix includes tantalum (Ta), tungsten (W), and niobium (Nb). The rheological properties of the composite inks are also analyzed for the DIW technique. The underlying reasons behind the increased mechanical, wear, and thermal properties are assessed through experimental and molecular dynamics simulations. Microstructural analysis is conducted using optical and scanning electron microscopes. Mechanical, electrical, thermal, and wear properties are evaluated at ambient temperature, and comparisons are established with DIW‐processed pure Cu. Elemental mapping through energy‐dispersive spectroscopy and high‐resolution transmission electron microscopy confirm the distribution of W, Ta, and Nb particles within the composite. The 3D printing of immiscible alloy components opens new avenues for exploring novel material properties, mixtures, and composite materials, thus fostering the development of innovative materials.