Abstract

AbstractThe study diagnosed engineering properties on varying moisture content of sunflower seed and kernel from 7.6 to 25% (wet basis). On increasing moisture, dimensional values increased for both seed and kernel. Bulk density, true density and porosity were found higher for kernel as compared to seed at each moisture content. On increasing the moisture content from 7.6 to 25%, true density, porosity and thousand kernel weight increased. Coefficient of static friction on plywood was found maximum for kernel at 25% moisture content, while it was minimum for seed on glass at 7.6% moisture content. The angle of repose was maximum for kernel as compared to seed. Initial cracking force, average rupture force and average rupture energy for seed and kernel decreased with an increase in the moisture content. The kernel was found to be more resistant to initial cracking than seed.

Highlights

  • Sunflower is one of the major oil seed crops which are grown worldwide

  • The study was carried out to find out the effect of moisture content on the engineering properties of sunflower seed and kernel

  • analysis of variance test (ANOVA) performed for both seed and kernel showed that moisture content had a significant effect on all engineering properties except length (p = 0.428) of kernel and sphericity of both seed (p = 0.314) and kernel (p = 0.148)

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Summary

Introduction

Sunflower is one of the major oil seed crops which are grown worldwide. Among four major oil seeds growing worldwide viz. soybean, brassicas, sunflower and groundnut, sunflower ranked third in totalABOUT THE AUTHORSMudasir Ahmad Malik is a doctorate student in the department of Food Engineering and Technology, Sant Longowal Institute of Engineering and Technology. Sunflower is one of the major oil seed crops which are grown worldwide. Among four major oil seeds growing worldwide viz. Mudasir Ahmad Malik is a doctorate student in the department of Food Engineering and Technology, Sant Longowal Institute of Engineering and Technology. He is having experience in studying the physical properties of various types of food grains. Charanjiv Singh Saini is an Associate Professor in the department of Food Engineering and Technology, Sant Longowal Institute of Engineering and Technology. He was the supervisor of the research. He is currently working in area of packaging material and special focus is on the development of edible packaging material from under-utilized food sources and from wastes of food industry

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