Abstract
One of the few remaining opportunities to increase heat dissipation in IC circuitry is to substantially decrease the thermal interface resistance between solid–solid contacts from source to sink. In this study, heterogeneous nanostructured mats (1–100μm thick, randomly oriented networks of nanostructures) are synthesized for use as thermal interface materials (TIMs). Recent studies suggest that mats composed entirely of carbon nanotubes (CNTs) or graphite nanofibers (GNFs) can act as thermal insulators due to significant phonon scattering at interfaces. In this work, graphene nanoplatelets (xGnPs) with high surface areas are included in CNT and GNF mats in order to increase the contact area between nanostructures and mitigate phonon scattering. Results indicate that an increase in contact area between nanostructures increases the thermal conductance across nanostructure networks by nearly an order of magnitude. Additionally, a study of the surface topography of CNT and GNF mats using atomic force microscopy (AFM) indicates that they are able to conform well to the asperities between rough, mating surfaces. Thus, an increase in contact area between CNT junctions not only produces a thermally conductive network, but also increases the reliability of a CNT mat TIM by avoiding common issues associated with the use of wetting agents.
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