Engineered Ceria Slurries for Electronic Glass Substrate CMP Application

Abstract

Glass substrates have gradually gained more attention as the media platters in hard disk drives (HDD) used in laptops, data centers, and cloud storage due to its advantageous properties. Particularly, advanced technologies like Heat Assisted Magnetic Recording (HAMR) in HDD and Through-Glass-Via (TGV) in 3D packaging applications all require the use of glass substrates with precisely controlled surface properties. Glass substrate’s advantages include lower weight, improved flatness, less flutter at high RPM’s and lower thermal expansion as compared to aluminum / NiP substrates. This lower expansion when exposed to heat makes it ideal for HAMR technology, which will be the key to creating hard disk drives with growing storage capacity. Chemical mechanical polishing (CMP) is a method to eliminate surface defects induced by grinding & lapping to meet final requirements of HAMR or TGV for glass substrates with surface finishes down to a few angstrom level or less. Key performance targets include removal rate, surface roughness, TTV, FSW, ceria residue / particle content (cleanability) on glass disks as well as recyclability. In this study, slurries for CMP are investigated utilizing engineered ultra-pure ceria particles which are known to have high material removal rate (MRR) on glass substrates. Various particle sizes, morphology, and chemical additives were evaluated. Results of systematic CMP tests including MRR, surface roughness, recyclability, and most importantly, ease of ceria residue removal from the glass substrate will be reported. Morphology of ceria particles was found to play a critical role in MRR. An optimized combination of ceria morphology and additive chemistries enables high MRR together with improved Ceria residue / cleanability performance. Figure 1