Energy-enhanced deposition of copper thin films by bipolar high power impulse magnetron sputtering

Abstract

Bipolar Pulse High Power Impulse Magnetron Sputtering (BP-HiPIMS) was investigated and used in this work to control the ion bombardment process of growing thin films and to improve their structure and properties. Energy-resolving mass spectroscopy was used to investigate the effect of reverse target voltage on the ion energies and fluxes during BP-HiPIMS of a high-purity copper target, in argon gas. It was found that the reverse target voltage provides a wide range of ion energies and fluxes incident to the growing film, which, in turn, produce a wide variety of effects during the deposition process, improving the adhesion strength and influencing both surface and bulk properties. Fast ICCD imaging was used to investigate both HiPIMS and BP-HiPIMS plasma dynamics. The temporal and spatial distributions of plasma potential measurements were performed in order to explain the mechanisms for accelerating the ions. The topological, structural and mechanical properties of the deposited coatings were investigated using atomic force microscopy (AFM), X-ray diffraction (XRD), Rutherford backscattering spectrometry (RBS), thermal desorption spectroscopy (TDS), scanning electron microscopy (SEM), nanoindentation and scratch tests. The obtained results indicate an energy-enhanced deposition process during BP-HiPIMS, the deposited films being characterized by smooth surfaces, dense microstructure, small inert gas inclusions, high elastic strain to failure, scratch resistance and good adhesion to the substrate. These improvements in the films' structure and properties may be attributed to the intense and energetic ion bombardment taking place during the deposition process. During BP-HiPIMS operation, there is no net increase in the deposition rate as compared to the monopolar regime due to the re-sputtering process.