Endochronic simulation for thermal viscoplastic and creep deformation

Abstract

In this study, the rate‐sensitivity function of the intrinsic time measure of the endochronic theory, which was proposed by Pan and Chern (1997), is reformulated so that it can be used to simulate thermal viscoplastic deformation. By using the scaling function of the intrinsic time scale of the endochronic theory, which was proposed by Pan et al. (1999), the thermal creep deformation of material can also be described. Experimental data of 40Pb/60Sn solder alloy subjected to pure tensile, creep and cyclic tension‐compression tests for several temperature ranges and strain‐rates, which were conducted by Sasaki et al. (2001), were used to compare with the endochronic simulation. Good agreement between the experimental result and the endochronic approach has been achieved.