Abstract
AbstractAnisotropic conductive film (ACF) is an essential component in the manufacture of liquid crystal displays, and an imidazole–epoxy resin system that exhibits a latent behavior is generally used as an adhesive in the ACF. In this study, a new copolymer was synthesized using methacrylic acid and dodecyl methacrylate, and this copolymer was used to encapsulate an imidazole curing agent to endow the ACF with latent behavior. A spray‐drying method was used in the encapsulation process, and this encapsulated imidazole was mixed with epoxy resin to form an imidazole–epoxy resin system. A comparison with our previous results showed that a smaller amount of polymeric material could be used in the encapsulating process, and a superior latent behavior could be obtained. © 2016 Society of Chemical Industry
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