Abstract
Technological trends in IC packaging in Japan are briefly reviewed. Epoxy resins have been successfully applied as encapsulating resins for ICs and LSIs (large-scale integrated circuits). An epoxy resin with improved moisture resistance has been effectively used in the production of VLSI devices. For the 1- to 4-Mb DRAMs that are soon going to be produced in Japan, the encapsulating resin must comply with strict requirements arising from a larger chip size, a higher device density, and up-to-date surface-mounting technology. The problems faced in this resin application, such as decreasing the heat stress, reducing the influence of solder dipping, and improving moisture resistance are described. The ways in which these problems are being solved are outlined.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">></ETX>
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